Transportpackage for electronic components



Components risk of wetting during transport is major because of exposure to open air and wide variations in temperature. Fibre based packaging materials absorbs and compensates moisture. Absorption can happen in few days or weeks depending how high relative humidity and temperature are. Damp condensation to surface or housings of components during transport and storage can cause serious problems in plastic based packages. Package material made by moulded pump technique binds moisture and helps and enables effective egress of damp.


Mechanical durability of package is important to electronics. In use are various tests to ensure durability for example throb, tremor and drop tests. Normally throb and tremor tests get hardly any difference between package materials. In drop testes fibre packages was found to protect products better than other alternative materials in relation to quantity of material.


Climatic tests have researched packages ability to protect product during humidity and temperature variations. Test have shown that different damp-proofmembranes anddesiccants can leaves out from fibre based packages. Tests showed that aluminium foil with desiccants kept humidity under critical level (50%) and thereby protects products wellagainst corrosion. In packages which was without damp-proof membranes and desiccants humidity increased over critical level. Despite this only into fibre based packages packed products not found corrosion. Corrosion damage was found only from products which was in packages which contains plastic without damp-proof membranes and desiccants.



Potential additional features of fiber packages:

  • Water-proofiness
  • Grease-proofiness
  • Printability
  • Fire-proofiness
  • Dyeability
  • Mildew-proofiness
  • Virginal wood fibre
  • Extra BULK
  • ESD
  • Corrosion prevent
  • Grain straw
  • Scent
  • Peat
  • etc.